NANO - 100

Designed for Nano-Materials R&D at Nanotechnology Companies and Universities
 
Applications include R&D, Small Scale Production, Specialized Processes, MEMs/NEMs. 
 
Affordable

Flexible

Upgradable

 
 
Features
  • 2-8 inch wafer capability
  • 12 inch and 14 inch chamber
  • Industrial PLC and PC based controller
  • Mechanical and Turbo Pumps
  • Very small foot print - 24 inch x 30 inch
  • Load-Locks provision for Cluster Tool capability
  • Four Process Power Supplies are Standard
  • Extensive Options for Sources and Fixturing

    Processes

  • Plasma Enchanced CVD (PECVD)
  • Hot Filament (PECVD)
  • DC and RF Multi-Source Bias Sputtering
  • Plasma and Reactive Ion Etching (RIE)
  • Ion Beam Deposition (IBD)
  • Carbon Arc and Thermal Evaporation
  • Atomic Layer Epitaxy (ALE)
  • Pulsed Laser Deposition (PLD)
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